Press Releases
Information contained in the press release is current as of the date of the press announcement,
but may be subject to change without prior notice.
but may be subject to change without prior notice.
MAY
May 8th, 2012
TDK Corporation has developed the mSATA type SSD (Solid- State Drive) SMG3B series with support for 3 Gbps serial ATA. The products will be available from July 2012.
APRIL
Apr 26th, 2012
TDK Corporation has expanded its portfolio of TDK X8R multilayer ceramic chip capacitors with new types that offer up to twice the capacitance of existing components with the same dimensions. At the same time, they are able to withstand the high operating temperatures encountered in car engine compartments. These advances were made possible by the development of a new dielectric material that maintains excellent reliability and thermal characteristics even in extreme environments. The new X8R MLCCs are available for rated voltages of 16, 25, 50 V DC and cover a capacitance range of between 10 nF and 10 μF. They are available in case sizes of between 1005 and 3225, depending on their voltage and capacitance values. Mass production of types in case sizes 3225 (16 V, 10 µF max.) and 3216 (25 V, 2.2 µF max. and 50 V, 1 µF max.) started in April 2012.
Apr 12th, 2012
TDK Corporation presents the new ACP3225 series of common-mode filter that offers im-proved performance in a smaller package when compared to existing products. Thus, the new wirewound common-mode filter features a current capability of 1.2 A and a common-mode impedance of 1000 Ω. These values are 20 percent and 25 percent higher, respec-tively than those of the existing ACM4532 series.
Apr 5th, 2012
TDK Corporation presents the new MHQ1005P series of multilayer ceramic inductors with a Q factor that, depending on the type, is as good or much better than comparable, but more expensive, wirewound inductors. The new multilayer ceramic components are thus suitable for use in low-loss RF matching circuits in devices such as smartphones and conventional mobile phones. The MHQ1005P, a series is already in mass production.
MARCH
Mar 21st, 2012
TDK Corporation has developed the eSSD series, a single chip 3Gbps SSD with serial ATA interface that uses multi-chip technology to integrate the TDK SSD control-ler GBDriver RS3 with NAND type flash memory in a single package. Sales are scheduled to begin in April.
For further information please contact:
Frank Trampnau
TDK Electronics Europe GmbH
Corporate Planning/Marketing
Wanheimer Strasse 57
D-40472 Duesseldorf
Tel: +49 (0)211 9077 127
Fax: +49 (0)211 9077 298
Email: trampnau@tdk.de
Internet: www.tdk-components.de
EPCOS